A Review On Transient Thermal Management of Electronic Devices

Abstract Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used applications involving time-varying workloads. These include microprocessors (particularly those portable devices), power such as IGBTs, and high-power semiconductor laser diode arrays. Transient become essential ensure performance reliability devices. In this review, emerging transient requirements identified, reported literature for presented with a focus time scales response. techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), pipes/vapor chambers, combined PCM-heat flash boiling systems examined detail. They compared terms their response times ascertain suitability pulsed workloads associated microprocessor chips, Thermal design guidelines selection appropriate package level resistance capacitance combinations also recommended.